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    • PVA TePla America, LLC
    • 251 Corporate Terrace
      Corona, Ca 92879.
    OKOS is now part of
    PVA Holding LLC
    Plasma Surface Cleaning
    Safe for the environment
    Wafer Inspection & Software
    PVA Software Production Automation
    High Performance
    Heat Treatment Furnace
    PVA TePla PulsPlasma® Nitriding
    equipment with several key advantages

    About Us / At home with details

    PVA TePla is one of the world’s leading system engineering companies. Its core competencies are in the fields of systems for hard-metal sintering and crystal growing as well as the use of plasma systems for surface activation, functionalization, coating, ultra-fine cleaning and etching.

    PVA TePla / Application

    Semiconductor

    Advanced Chip Packaging plasma applications include plasma wafer cleaning for wafer level packaging, chip carrier plasma cleaning prior to wire bonding, encapsulation and Flip Chip under fill

    Semiconductor

    Adhesion promotion

    Improve adhesive bond properties of materials.  Plasma is ideal for treating plastics, metals, ceramics, and glass prior to adhesive bonding. In each case, loose boundary films are removed and truly hyper-clean surfaces remain. For plastics,

    Adhesion promotion

    Carbon Ash

    Metallization of through-vias is often impeded by carbonaceous deposits formed during laser drilling. To remove these deposits from vias, the printed circuit boards are immersed into gas plasma

    Carbon Ash

    Anisotropic conductive film

    Plasma is used to promote the adhesion of anisotropic conductive film in flat panel display manufacture An LDI chip is attached to a tape-carrier package (TCP), and then connected to

    Anisotropic conductive film

    Desmear

    Plasma desmear and etch-back by plasma is an established practice in the PCB industry. Drilling vias through multilayer PCB’s leaves residue, or smear, on the via walls.

    Desmear

    Feedthrough potting

    Electronic connectors and cable assemblies are used for communications and data transfer applications as well as for power connections. The insulative body around the contacts or feedthroughs often needs to

    Feedthrough potting

    News

    The global demand for graphite is surging and expected to continue for decades,driven by the broad use of graphite for

    Ashing, in which the light–sensitive coating known as photoresist is removed and cleaned from an etchedwafer, is one of the

    Traditional plate or shell and tube heat exchangers have long been used in processing industries. Today however, with many new

    Joining dissimilar metals has tremendous potential for conformal cooling, but to successfully use diffusion bonding, a mold builder must understand

    PVA TePla / Services

    Contact Us

    If you have any questions or suggestions, please don’t hesitate to get in touch with us directly. We will contact you.