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    • PVA TePla America, LLC
    • 251 Corporate Terrace
      Corona, Ca 92879.

    PHOTORESIST ASHING IoN 10V

    Plasma Ashing & RIE System

    SINGLE WAFER ASHING SYSTEM

    The Photoresist Ashing IoN 10V plasma system is a manual load single wafer RF plasma Ashing, RIE and Descum system. This low cost, mid-sized single wafer system is loaded with advanced features and targets the needs of small scale foundries, universities and start-up companies. The Photoresist Ashing IoN 10V plasma system is equipped with new, state of the art components and software to precisely control processing parameters. This technology has been successfully used for power transistors, analog devices, sensors, optical devices, photonics, MEMS/MOEMS, bio devices, etc. The small footprint of the IoN 10V requires minimal laboratory space and provides for simple installation and maintenance. Leveling casters and brakes allow for easy installation and flexibility.

    Features include:

    • Small foot print design
    • Stainless Steel chamber accommodating up to 8” wafers
    • 7” Touch Screen PC Controller with auto and Manual mode operation
    • User access control for process development and maintenance programming.
    • Plug and play installation
    • Pressure Control

    Typical application:

    • Photoresist stripping
    • Wafer descum
    • Wafer cleaning prior to wet etching
    • SU-8 removal
    • Etching of passivation layers
    • Reactive IoN Etch (RIE) Configurable
    • Batch Wafer System

    Technical Data

    Process Chamber

    • Material Aluminum
    • Electrode: 9.0” (230mm) Dia.
    • Dimensions 12.68” (322mm) Dia.x3.15”H (80mm)
    • Volume 6.51 Liters (.23cu.ft3)
    • Process Gas Up to 4 gasses, MFC Controlled
    • Base Pressure .07 mbar (50 mTorr)
    • Process Pressure .05-1.5 mbar (375-1125 mTorr)
    • Evacuation Time ~1 minute

    Safety Certification Standards

    • CE Certified
    • EN 61010
    • EN 61326

    Plasma Generator

    13.56 MHz, 300 Watts

    Dimensions

    686mm x 1003mm x 1270mm (W x D x H)
    27” x 39.5” x 48” (W x D x H)

    Weight

    134 kg / 295 lbs. depends on options

    Facilities Requirements

    • Electricity 230V, I ph., 50/60hz, 10a
    • Process Gas 1-2 Bar (15-30psi)
    • Compressed Air 4-6 Bar, capable of delivering 56 Lpm (intermittent)
    • Purge Gas 1.3-2.7 Bar, capable of delivering 28 l/m (intermittent)

    Options

    • Input power step-up transformer 115-230 VAC
    • Temperature controlled plate
    • Light tower
    • Printer
    • Vacuum pump option:
      • 12 cfm (20 m3/h)
      • 18 cfm (31 m3/h)
      • 28 cfm (48 m3/h)
    • Dry and Scroll pumps available