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    PVA TePla America, LLC/ News Articles /General/Scanning acoustic microscopy and analysing 3D packages in the Z-dimension

    Scanning acoustic microscopy and analysing 3D packages in the Z-dimension

    The concept behind advanced 3D packaging is to stack multiple dies or wafers in a vertical direction – or Z-dimension – to achieve better performance, with lower power requirements, smaller size and lower cost.

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