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    • PVA TePla America, LLC
    • 251 Corporate Terrace
      Corona, Ca 92879.
    PVA TePla America, LLC/Products/RF Plasma Systems/Plasma Surface Treatment & CVD Deposition/IoN 3B PLASMA SYSTEM

    IoN 3B PLASMA SYSTEM

    IoN 3b Gas plasma system

    The IoN 3B plasma system is designed for R&D and low volume production applications. A compact, fully integrated low frequency generated plasma is used in IoN 3B plasma system. The small table top design is specifically intended to meet the evolving demands of customer surface treatment needs at a low cost of ownership. PVA TePla is a proven and trusted resource globally for high-quality, reliable, cost-effective and easy to operate gas plasma systems. It offers some of the most advanced and innovative solutions for a wide variety of applications.

    Typical Applications:

    • Surface cleaning
    • Surface activation

    Features Include:

    • Small foot print table top design
    • Plug and play self installation
    • 45 mm (1.77”) diameter view port
    • Flexible electrode
    • PC touch screen
    • Graphical User Interface (GUI)
    • Recipe editor for fast and versatile step controls
    • Features Include:
    • Small foot print table top design
    • Plug and play self installation
    • 45 mm (1.77”) diameter view port
    • Flexible electrode
    • Industrial computer with LCD touch panel and keyboard. Windows based operating system
    • Graphical User Interface (GUI)
    • Recipe editor for fast and versatile step controls

    Technical Data

    Process Chamber

    • Material: Aluminum
    • Dimension: 140 mm W x 200 mm D x 110 mm H
    • (5.5”x7.87”x4.33”)
    • Volume: 3.07 L (0.11 ft3)
    • Electrodes: Ceiling, single shelf
    • Number of standard MFCs: 1
    • Base Pressure: 0.07 mbar (50 mTorr)
    • Pumping Time: 1 min (Pump dependent)
    • Loading: Manual

    Plasma Generator

    Frequency/power: (20 to 100) kHz/100 W

    Options

    • Quartz chamber, 100 mm Dia x 200 mm L
    • Water cooled electrode
    • (20 to 100) kHz/200 W
    • Secondary plasma
      • Faraday/Etch cage
    • Additional MFCs
    • Corrosive gas MFCs
    • Process pressure control
    • Light tower with R/Y/G/Buzzer
    • Vacuum pump (Rotary vane, scroll)

    Machine Dimension and Weight

    • 580 mm W x 610 mm D x 350 mm H (23” x 24” x 14”)
    • 59 kg (131 1b) (Varies with options)

    Facilities Requirements

    • Electricity: (110/220) VAC, 1f, 50/60 Hz, 3 wire, 2.3kW
    • Process Gas Input Pressure: 1.4 bar (20 psi)
    • Purge Gas Input Pressure: 1.4 bar (20 psi)
    • Compressed Air Input Pressure: 1.4 bar (20 psi)

    Safety Certification Standards

    • CE Certified
    • EN 61010
    • EN 60204