Cleaning is the most common application for gas plasma. Gas plasma cleaning is typically used for final removal of organic films. Hyperclean surfaces are obtained by removing the thin layer of organic contamination that is present on almost all surfaces. This layer may be only a few molecules thick but this is sufficient to change interface properties. Heavy machine oils, dust particles etc. must be first removed by wet processing or by physical means. The final clean with plasma is usually carried out with low pressure oxygen gas in a few minutes with no chemical waste to deal with. And, unlike solvent cleaners, plasma leaves absolutely no residue.
