9104 Plasma system

Did you know that PVA TePla may be able to perform maintenance, repair, or provide parts to this system? Please contact our customer service department for further information.
800-527-5667 M-F 8am – 5pm Pacific Time.

Features and Specifications

Gasonics/IPC 9102 Ash/Etch system
12″(dia) x 20″(D) quartz barrel, soft pumping and purge valving, low particulate design, 2ea mass flow gas inputs with VCR fittings, all SS plumbing, multi channel/single board computer controlled, with floppy storage, temperature controller, ENI OEM 12B 1250W RF Generator

• Wafer Size: 4″, 6″, 8″ capability
• Capacity: 50 8” wafers, 50-75 6” wafers, 100 4” wafers.
• Chamber: Quartz, compatible with fluorinated chemistry. 12″ diameter x 20″ deep. External RF electrodes.
• RF Generator: 1000 watt 13.56 MHz air cooled with automatic impedance matching network. Water cooled optional.
• Process Pressure: Approx. 120 – 2000 mtorr.
• Stainless Steel Plumbing.
• Temperature Monitor: Quartz-coated thermocouple located in the process chamber.
• Display: Color 12.1″ touch screen for control and monitoring of process parameters, automatic recipes, or manual plasma treatments.
• Four user specified gases, with 500 sccm Stainless Steel MFCs come standard with an optional 3rd and/or 4th gas channel available.
• Power Requirements: 208 – 240 volts, 3ø, 50/60 Hz 5 wire “wye”.
• A NEMA-12 wall mounting enclosure with locking handle contains the system AC power control for the system and pump, allows for a single source drop for the complete system.
• CE Certified.