Our Wafer Metrology Systems offer unique stress/defect analysis and ion implantation monitoring for quality inspection of 300 mm wafers for high volume manufacturers.
Our Scanning Acoustic Microscopes are used for defect detection, quality control and nondestructive failure analysis of bonded wafers and packaged electronics. We specialize in high throughput production environments and fully automated handling systems.
The SIRD is a stress measurement system at wafer level for process monitoring, which will contribute to cost reduction as well as yield improvement.
The Implant process is a very critical step within the integrated circuits manufacturing line. It defines important characteristics and properties of the devices-to-be by doping certain layers of the silicon substrate.
The SIRD systems and SIRIS systems use polarized light, which is transmitted through the substrate material and the depolarization of…
Munich Metrology VPD Systems PVA TePla MPS Munich Metrology GmbH, a wholly owned subsidiary of PVA TePla, is a leading…
