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    • PVA TePla America, LLC
    • 251 Corporate Terrace
      Corona, Ca 92879.

    IoN 10Q Plasma System

    IoN 10Q RF Plasma System
    IoN 10Q RF Plasma System

    The IoN 10Q Plasma System is a barrel plasma reactor designed for R&D and production applications. The technology is based on the proven reactor designs developed over the course of 50+ years by International Plasma Corporation, Branson IPC, Dionex, Gasonics, Metroline, TePla and finally PVA TePla. PVA TePla is a proven and trusted resource globally for high-quality, reliable, cost-effective and easy to operate Gas Plasma Systems. It offers some of the most advanced and innovative solutions for a wide variety of applications.

    Features Include:

    • Small foot print table top design
    • Plug and play self installation
    • Industrial computer with LCD touch panel and keyboard. Windows based operating system
    • Graphical User Interface (GUI) software complies with CFR Title 21 Part 11 and Semi E95-1101
    • Multi-level user access
    • Software
    • Recipe editor for fast and versatile step controls
    • Onboard diagnostic features and alarm logging
    • Remote process monitoring via Ethernet
    • Online web based simulation/training/support

    Typical applications

    • Photoresist ashing and Descum
    • Surface cleaning
    • Surface activation

    Technical Data

    Process Chamber

    • Material: Quartz chamber
    • Dimension: 248 mm D x245 mm L (9.76” x9.65”)
    • Volume: 11.83 L (0.42 ft3)
    • Chamber Opening: 241 mm (9.5”) at seal plate
    • Electrodes: Clam-Shell
    • Number of MFCs: 1
    • Process Pressure: (0.16 to 2.66) mbar
    • (120 to 2000) mTorr
    • Base Pressure: 0.07 mbar (50 mTorr)
    • Pumping Time: 1 min (Pump dependent)
    • Wafer Sizes: Up to 200 mm (8”)
    • Batch size (Boat): 25 wafers of diameter 150 mm (6”)
    • Batch size (Plate): 1 wafers of diameter 200 mm (8”)
    • Wafer Loading: Manual

    Plasma Generator

    Frequency/power: 13.56 MHz/600 W

    Options

    • Automated robotic loading/unloading
    • Ceramic chamber and chemical resistant seals
    • Larger chamber—248 mm D x 395 mm L
    • 20-100 kHz/600 W plasma generator
    • Secondary plasma
    • Faraday/Etch tunnel
    • Additional MFCs/Up to 5 additional gases
    • End point detectors
    • Single wavelength
    • Spectrographic
    • Process pressure control
    • Light tower with R/Y/G/Buzzer
    • Barcode scanner; RGA; Printer
    • Vacuum pumps (Rotary vane, dry)
    • Gas generators (H2, N2, O2)
    • SECs/GEM interface

    Machine Dimension and Weight

    • 737 mm W x 663 mm D x 692 mm H (29”x26”x27.3”)
    • 156.36 kg (344.71 lb) (Varies with options)

    Performance Data

    • Uptime: 95%
    • MTBF: >500 h
    • MTTR: <2 h

    Facilities Requirements

    • Electricity: 110/220 VAC, 1f, 50/60 Hz, 3 wire, 2.3 kW
    • Process Gas Input Pressure: 2 bar (30 psi)
    • Purge Gas Input Pressure: 2 bar (30 psi)
    • Compressed Air Input Pressure: 6 bar (88 psi)

    Safety Certification Standards

    • CE certified
    • EN 61010
    • EN 61326