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    • PVA TePla America, LLC
    • 251 Corporate Terrace
      Corona, Ca 92879.
    PVA TePla America, LLC/Products/RF Plasma Systems/Plasma Surface Treatment & CVD Deposition/IoN 100 Plasma System

    IoN 100 Plasma System

    IoN 100 Plasma Treatment System

    IoN 100 Plasma System

    The IoN 100 is a barrel plasma reactor designed for R&D and production applications. The technology is based on the proven reactor designs developed over the course of 50+ years by International Plasma Corporation, Branson ICP, Dionex, Gasonics, Metroline, TePla and finally PVA TePla. IoN 100 uses a larger chassis that provides all the gas and power connections.

    Features Include:

    • Plug and play self installation
    • Flexible electrodes
    • Industrial computer with LCD touch panel and keyboard.
    • Windows based operating system.
    • Graphical User Interface (GUI) software complies with
    • CFR Title 21 Part 11 and Semi E95-1101
    • Multi-level user access
    • Software
      • Recipe editor for fast and versatile step controls
      • Onboard diagnostic features and alarm logging
      • Remote process monitoring via Ethernet
      • Online web based simulation/training/support
    • Pump power outlet on the chassis
    • Energy saving feature—pump control

    TYPICAL APPLICATIONS:

    • Surface cleaning
    • Surface activation
    • Surface functionalization
    • Deposition of siloxane and organic thin films

    Technical Data

    Process Chamber

    Material: Aluminum
    Dimension: 375 mm W x 762 mm D x 375 mm H
    (14.75”x30”x14.75”)
    Volume: 107 L (3.78 ft3)
    Electrodes: 5 Shelf
    Number of MFCs: 1
    Process Pressure: (0.16 to 2.66) mbar
    (120 to 2000) mTorr
    Base Pressure: 0.07 mbar (50 mTorr)
    Pumping Time: 1 min (Pump dependent)
    Loading: Manual

    Plasma Generator

    Frequency/power: 13.56 MHz/600 W

    Safety Certification Standards

    • CE certified
    • EN 60204
    • EN 61326

    Options

    • Automated robotic loading/unloading
    • Stainless steel chamber
    • Electrodes:
      • Self electrode 3/7
      • Multishelf with 3/5/7/9/11 or 13 shelve
      • Vertical or ceiling
      • Power cage
    • Secondary plasma
      • Faraday/Etch cage
    • Plasma generators
      • 13.56 MHz/1000 W
      • (20 to100) kHz/600 W or 1000 W
    • Additional MFCs/up to additional five gasses
    • Corrosive gas MFCs
    • Liquid monomer delivery kits
      • High/Low vapor pressure monomers
    • Process pressure control
    • Light tower with R/Y/G/Buzzer
    • Vacuum pumps (Rotary vane, dry)
    • Onboard gas generators (H2, N2, O2)
    • Wall mounting package
    • SECS/GEM interface

    Chassis

    • Larger roll around chassis with leveling feet
    • Self contained footprint featuring all gas and all power connections.

    Machine Dimension and Weight

    737 mm W x 1067 mm D x 1981mm H (29”x42”x78”)
    350 kg (702 lb) (Varies with options)
    Performance Data
    Uptime: 95%
    MTBF: >500 h
    MTTR: <2 h

    Facilities Requirements

    Electricity: (208/240) VAC, 3f, 50/60 Hz, 5-wire,12.8 kW
    Process Gas Input Pressure: 2 bar (30 psi)
    Purge Gas Input Pressure: 2 bar (30 psi)
    Compressed Air Input Pressure: 6 bar (88 psi)