Producing electronic devices, boards, IGBT’s and other complex components depends crucially on bonding, soldering and encapsulation. The Auto Tray allows for non-destructively inspecting devices for such failures.
Main applications include detection of voids, inclusions, and delaminated areas in bonding interfaces and thickness variations in layer structures. These defects may occur in different layers of the device. In production high throughput is required, hence PVA TePla Analytical’s proprietary software supports the simultaneous inspection of several layers.
The Auto Tray, the customized solution for inline process diagnostics and control, can be integrated in any production environment because it features:
