Auto Wafer 300

Auto Wafer 300 Non destructive, automated wafer testing

Auto Wafer 300 denotes a product line especially developed for automated scanning of bonded wafers. Auto Wafer 300 non-destructively tests bonded wafers for voids, inclusions or delaminated areas in the bonding interfaces, automatically analysis for defects and exports results in format utilized by the fab.

High Throughput In all production facilities time is most valuable. Hence Auto Wafer 300 is optimized for high throughput with 4 transducers and automated wafer handling.

High Level of Automation and Integration The robust design of Auto Wafer 300 aims for best performance with low footprint.

Adaptability Our customer’s factory sets the environment and specification for Auto Wafer 300. It meets the clean-room specifications down to class 100 (lower classes on request). Various features of Auto Wafer 300 ensure easy integration in the production process:

• Cassette loading systems for both easy and quick loading (open load port, SMIF, FOUP or customized input and output cassettes)
• Robot for handling 5-12 inch wafers
• Pre aligner for notch detection and correct alignment for acoustic imaging
• Drying unit
• Data analysis with automated delamination detection and recording
• GEM SECS interface for smooth data flow
• Integrated bar code reader or HERMOS reader for wafer tracking
• Degassing system for process water
• Automatic water exchange with conductance monitoring