The emergence of highly accurate wafer bonding and die
stacking has enabled new generations of 3D semiconductors. As
stacks grow, so does complexity, which in turn makes reliable, nondestructive inspection and testing critical to high yield and product
reliability. PVA TePla Analytical Systems discusses scanning acoustic
microscopy (SAM) as a means to ensure scalable, accurate
inspection.
Click Read More to read more on Rely on SAM for 3D package device analysis
